04/2023 [Service] I was appointed as the Associate Editor-in-Chief of the IEEE Transactions on Very Large Scale Integration Systems (TVLSI). We welcome your submission!
04/2023 [Service] Joined TPC of ICCAD, SOCC, AICAS, VLSI-SoC and WCAE.
12/2022 [Award] My student Runxi received the prestigious IEEE Woman in Engineering International Scholarship (Only one awarded every year)! Big congrats!
12/2022 [Research] My student Runxi won Best Paper Award at the Semiconductor Technology Forum held in Shanghai! Congrats!
09/2022 [Research] Our work received the best paper award at SOCC 2022! Congrats to my student Xiangdong and the team!
08/2022 [Research] Invited talk at Aijishu Open Course (极术公开课)!
08/2022 [Research] Talk on RISC-V ISA Extensions at RISC-V Summit China 2022!
08/2022 [Research] Invited talk at MWSCAS 2022 on chip reliability and cross-layer design.
08/2022 [Research] Received CCF-Tencent Open Funds! Thanks CCF and Tencent!
07/2022 [Research] Our work on reconfigurable ASCON processor has been accepted by IEEE SoC Conference.
07/2022 [Service] I was featured on the IEEE SSCS Magazine, the flagship publication of the IEEE Solid-State Circuit Society. A link is available here.
06/2022 [Research] Our J-Eye team presented the work at the Zhidongxi Open Course (智东西公开课), a recording is available here.
05/2022 [Research] I gave a talk “Chip Design in the 21st Century: The Intersection of Everything” at UM-SJTU JI/GIFT Graduate Seminar Series.
04/2022 [Research] Congrats to my students Runxi and Yuqi for receiving the p04/2022 [Research] Congrats to my students Runxi and Yuqi for receiving the prestigious inaugural “Women in Technology” award (The only team in this category) from the AMD-Xilinx Adaptive Computing Challenge 2021! (Competition) (Project) (SJTU News) (JI News)(Xilinx News)
04/2022 [Service] I hosted the IEEE Solid State Society (SSCS) Webinar for Young Excellence (WYE) “Grant Proposal Writing Tips and Strategies: Securing Funds for your Brilliant Research Idea”. The recording is available here.
04/2022 [Research] Our work on developing agile framework for AES (called Agile-AES) has been accepted by Integration!
02/2022 [Service] Joined ICCAD 2022, SAMOS, GLVLSI, ASAP and FCCM TPC!
02/2022 [Research] Our work on 3DIC cooling was accepted by IEEE ITherm Conference!